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METHOD FOR MANUFACTURING PRECISE PCB, CAPABLE OF FORMING CONDUCTIVE LINE IN THROUGH HOLE AND CIRCUIT PATTERN
METHOD FOR MANUFACTURING PRECISE PCB, CAPABLE OF FORMING CONDUCTIVE LINE IN THROUGH HOLE AND CIRCUIT PATTERN
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机译:能够通过孔和电路图形形成导电线的精密PCB的制造方法
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摘要
The present invention relates to a method for forming a precise PCB, capable of forming a conductive line in a through hole and a circuit pattern. The method for forming the precise PCB includes the steps of forming a first circuit pattern with conductivity comprising a circuit on the upper side of an insulation layer; forming a second circuit pattern with conductivity comprising a circuit on the lower side of the insulation layer; forming a through hole which vertically passes through the insulation layer; and forming a conductive material on the inner circumference of the through hole to electrically connect the first and second circuit patterns by the through hole.;COPYRIGHT KIPO 2014;[Reference numerals] (AA) First circuit pattern printing process; (BB) Second circuit pattern printing process; (CC) Protective film laminating process; (DD) Through hole processing process; (EE) Through hole printing process; (FF) Protective film delaminating and heat treatment process
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