DEVELOPING SOLUTION AND DEVELOPMENT PROCESSING METHOD OF PHOTOSENSITIVE RESIN COMPOSITION

摘要

The present invention provides a developing solution for a polyimide precursor, which increases a development margin, wherein a film thickness of a polyimide-based resin film is not decreased during the development and safety is high. Also provided are a development processing method of a photosensitive resin composition by using the developing solution and a pattern forming method using the development processing method. The developing solution for the polyimide precursor contains: (a) N,N,N,N-tetramethylurea and (b) low alcohol having 1 to 5 carbon atoms. The development processing method of the photosensitive resin composition comprises a process of developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution. The pattern forming method comprises the processes of: forming a coating film or a molding body formed of the photosensitive polyimide precursor resin composition; selectively exposing the coating film or the molding body; and developing the exposed coating film or the molding body by the development processing method.