LASER CUTTING APPARATUS FOR GLASS SUBSTRATE AND METHOD FOR CUTTING GLASS SUBSTRATE

摘要

The present invention relates to a device and a method for cutting a glass substrate using a laser, the device comprising: a laser light source unit generating and outputting a laser beam; a scanner head irradiating the laser beam projected from the laser light source unit along a line to be cut through on a glass substrate loaded on a stage; and a controlling unit controlling the operations of the laser light source unit and scanner head. The scanner head comprises: a scanner unit reflecting laser light in a desired pattern shape on the glass substrate by adjusting the vertical and horizontal displacement of the laser beam projected from the laser light source unit; a focus lens unit installed at the rear end of the scanner unit and adjusting the laser beam projected from the scanner unit to be focused on the glass substrate; and a focus lens operating unit adjusting the depth of the laser beam by adjusting the height of the focus lens unit.