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Experimental Investigation on Cutting Characteristics in Nanometric Plunge-Cutting of BK7 and Fused Silica Glasses

机译:BK7和熔融石英玻璃纳米切入切割中切削特性的实验研究

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摘要

Ductile cutting are most widely used in fabricating high-quality optical glass components to achieve crack-free surfaces. For ultra-precision machining of brittle glass materials, critical undeformed chip thickness (CUCT) commonly plays a pivotal role in determining the transition point from ductile cutting to brittle cutting. In this research, cutting characteristics in nanometric cutting of BK7 and fused silica glasses, including machined surface morphology, surface roughness, cutting force and specific cutting energy, were investigated with nanometric plunge-cutting experiments. The same cutting speed of 300 mm/min was used in the experiments with single-crystal diamond tool. CUCT was determined according to the mentioned cutting characteristics. The results revealed that 320 nm was found as the CUCT in BK7 cutting and 50 nm was determined as the size effect of undeformed chip thickness. A high-quality machined surface could be obtained with the undeformed chip thickness between 50 and 320 nm at ductile cutting stage. Moreover, no CUCT was identified in fused silica cutting with the current cutting conditions, and brittle-fracture mechanism was confirmed as the predominant chip-separation mode throughout the nanometric cutting operation.
机译:延性切割最广泛地用于制造高质量的光学玻璃组件,以实现无裂纹的表面。对于脆性玻璃材料的超精密加工,关键的未变形切屑厚度(CUCT)通常在确定从延展性切削到脆性切削的过渡点方面起关键作用。在这项研究中,通过纳米切入切割实验研究了BK7和熔融石英玻璃的纳米切割性能,包括加工后的表面形态,表面粗糙度,切割力和比切割能量。在单晶金刚石工具的实验中,使用了相同的300 mm / min的切削速度。根据上述切削特性确定了CUCT。结果表明,在BK7切削中发现CUCT为320 nm,而未变形切屑厚度的尺寸效应确定为50 nm。在韧性切割阶段,可以获得高质量的加工表面,其未变形的切屑厚度在50至320 nm之间。此外,在目前的切割条件下,在熔融石英切割中未发现CUCT,在整个纳米切割操作中,脆性断裂机理被确认为主要的切屑分离模式。

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