HEAT DISSIPATION FLEXIBLE MODULE FOR LED USING PRINTED ELECTRONIC TECHNOLOGY AND METHOD FOR MANUFACTURING SAME

摘要

The present invention relates to a heat dissipation flexible module for an LED using printed electronic technology and a method for manufacturing the same and, more specifically, to a high heat dissipation board having a circuit pattern of a conductive paste printed on an insulating layer, a heat dissipation module for an LED using the same, and a method for manufacturing the same. According to the present invention, a high dissipation board with improved heat dissipation properties and light-weight and softness properties, which has a circuit pattern of a conductive paste formed on an insulating layer by a printing method, and a method for manufacturing the same can be provided, and the high heat dissipation board is applicable to a heat dissipation flexible module for an LED.;COPYRIGHT KIPO 2014