Composite for glass encapsulant of ultraviolet rays-light emitting diode device and manufacturing method of glass encapsulant for ultraviolet rays-light emitting diode device

摘要

The present invention relates to a glass encapsulant composition for ultraviolet rays-light emitting diode which includes 60.0-72.0 mole% of SiO_2, 2.0-3.2 mole% of Al_2O_3, 4.0-6.4 mole% of B_2O_3, 6.0-18.0 mole% of one or more substances selected among BaO and BaCO_3, 12.4-16.0 mole% of one or more substances selected among Na_2O and Na_2CO_3; and to a method for manufacturing the glass encapsulant for ultraviolet rays-light emitting diode using the same. According to the present invention, the glass encapsulant composition for ultraviolet rays-light emitting diode which has no yellowing phenomenon when using in UV region or for long term, has high heat resistance, has no device degradation or electrode corrosion by having high gas barrier property, and has high UV transmissivity can be manufactured.