Processing saw residues from the production of silicon wafers involves separating polyethylene glycol from solid components of residues and treating solid components with chloromethane and/or dichloromethane and hydrogen

摘要

Processing saw residues from the production of silicon wafers, comprises mechanically separating polyethylene glycol from solid components of saw residues, treating the solid components with chloromethane and/or dichloromethane and hydrogen in presence of Muller Rochow synthesis catalyst at a temperature of 350-650[deg] C to form gaseous methylchlorosilanes, performing distillation of the gaseous methylchlorosilanes to separate silicon carbide under oxidizing atmosphere at temperature of 680-750[deg] C, and placing the product in a reactor and then heating up and subjecting to acid wash to classify.