Floor system for use in Heating/cooling element to heat or cool space i.e. light spacing, of ceiling of building, has support plate arranged at top face of heat guide plates, and pipes utilized for guiding carrier mediums into guide plates

摘要

The system has carrying profiles (1) attached to each other along lateral distance. A thermal leading ceiling panel is arranged in the carrying profiles. Heat guide plates (3) of the ceiling panel are arranged between the carrying profiles. The heat guide plates are formed in an underside (12) of the ceiling panel. A support plate (8) is arranged at a top face (20) of the heat guide plates, where width of the support plate is larger than diameter of the carrying profiles. Pipes (7) are utilized for guiding heat carrier mediums into the heat guide plates. The heat guide plates and the ceiling panel are made from compacted graphite material.