Bonding first component having high thermal conductivity, preferably metallic component with additional component by means of heat-activatable adhesive, comprises heating the first component during the bonding

摘要

Bonding a first component (12) having high thermal conductivity, preferably a metallic component with at least one additional component (14) by means of a heat-activatable adhesive, which is activated by microwave irradiation, comprises heating the first component during the bonding. An independent claim is also included for a device for bonding the first component having high thermal conductivity, preferably the metallic component with at least one additional component comprises a microwave radiator for heating the heat-activatable adhesive, and a heating device for heating the first component.