Method and apparatus for contactless warp- and a tension analysis with the aid of optical measurement or sensor systems

摘要

Method and apparatus for contactless warp- and a tension analysis with the aid of optical measurement or sensor systems (2), with the optical measurement or a sensor system (2) is the surface of a desired structure (1) are detected and by means of a load (4) into the desired structure (1) and distortions or voltages to be analyzed, characterised in that the optical measurement or a sensor system (2) in addition to the detection of the distortions and stresses due to displacement, twisting and / or deformations of the desired structure (1) a position changes caused on the surface of the desired structure (1) predetermined measurement range (3) can be seen on the basis of the change in position control signals is determined, and with the aid of the control signals control a tracking device (5) is driven, so that a compensation of changes in position between the measuring or a sensor system (2) to the measuring area (3) is carried out.