Cooling arrangement for cooling e.g. processor of computer system, has air scoop including inlet opening that is arranged within airflow of fan, and outlet opening arranged so that component to be cooled is detected by deflected air flow

摘要

The arrangement (K) has a cooling body (3) fixed on a component (1) to be cooled. A fan (4) produces an airflow through openings within the body over the component. An air scoop (6) includes an opening (8) e.g. inlet opening and outlet opening, for deflecting a part of the produced air flow around more than 90 degrees. The scoop is designed so that the inlet opening is arranged within the airflow of the fan behind an exit side of the fan. The outlet opening is arranged so that another component to be cooled is detected by the deflected air flow. The scoop is made of a plastic material.