Bonding wire for use in power-electronic module and electrical component, has filament whose melting temperature at specific pressure is higher than melting temperature of matrix at specific pressure

摘要

The bonding wire (1) has several filaments (10) and a matrix (20). The matrix is embedded into the filaments. The melting temperature of each filament at a pressure of 1013.25hPa is higher over 450[deg] C than the melting temperature of the matrix at a pressure of 1013.25hPa. The filament is made of materials consists of alloy, zinc, magnesium, aluminum, silver, gold, copper, beryllium, nickel, iron, palladium, platinum, chrome, rhodium, iridium, ruthenium, molybdenum, tantalum and tungsten. An independent claim is included for method for manufacturing an electrical component.