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Copper alloy strip for a lead frame of an led

机译:LED引线框架用铜合金带

摘要

It is a lead frame, which consists of a copper alloy strip is produced on cu-fe-base, in order to improve the heat dissipation is provided in a led module. A reflecting ag-plating, which is formed on said lead frame, increases the brightness of the led module. In the copper alloy strip on cu-fe-base, the arithmetic mean roughness value ra 0.2 μm or less, the average ten-point roughness rzWith jis is 1.2 μm or less and the maximum height of the surface roughness rz is 1.5 μm or less and recesses have an average length parallel to the rolling direction of from 2 to 100 μm, an average length perpendicular to the direction of rolling of from 1 to 30 μm and a maximum depth is parallel to the rolling direction of 400 nm or less. The copper alloy strip contains on cu-fe-base 1.8 to 2.6% by weight of fe, 0.005 to 0.20% by weight of p and 0.01 to 0.50% by weight of zn or contains 0.01 to 0.5% by weight of fe, 0.01 to 0.20% by weight of p, 0.01 to 1.0% by weight of zn and from 0.01 to 0.15% by weight sn.
机译:它是一种引线框架,由铜合金带材制成,该铜合金带材在cu-fe基底上生产,以改善LED模块中的散热。形成在所述引线框架上的反射性镀AG层增加了LED模块的亮度。在以cu-fe为基底的铜合金带中,算术平均粗糙度值ra为0.2μm以下,平均十点粗糙度rz with jis 为1.2μm以下,且最大高度为表面粗糙度rz为1.5μm或更小,凹部的平行于轧制方向的平均长度为2至100μm,垂直于轧制方向的平均长度为1至30μm,并且最大深度平行于轧制方向为400nm或更小。铜合金带材在Cu-Fe基上包含1.8至2.6重量%的Fe,0.005至0.20重量%的P和0.01至0.50重量%的Zn,或包含0.01至0.5重量%的Fe,0.01至0.5重量%的Fe。 p为0.20重量%,zn为0.01至1.0重量%,sn为0.01至0.15重量%。

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