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LED COPPER ALLOY STRIP FOR LEAD FRAME OF LED

机译:LED铅框架用LED铜合金带

摘要

present invention, Cu-Fe-based copper alloy plate consisting of a lead frame of the tank conductivity and to improve the thermal conductivity, improving the heat dissipation properties of the LED package, but also to improve the reflectivity of the Ag plating reflection film formed on the surface of the lead frame, thereby realizing a high luminance of the LED package. In Cu-Fe-based copper alloy sheet article, the surface roughness of the vertical rolling Ra: 0.2 or less, Rz JIS : 1.2 below, R Z: 1.5 mu m or less and an average length in the rolling direction parallel The 2~100 , the average length of the vertical rolling 1~30 , rolling along the direction parallel to the maximum depth is formed densely on the surface of recess 400 nm or less. Ra is the arithmetic average roughness, Rz JIS is a ten-point average roughness, Rz is the maximum height of roughness. Cu-Fe-based copper alloy sheet, Joe Fe: 1.8~2.6 mass%, P: 0.005~0.20 weight%, Zn: 0.01~0.50 including mass% or Fe: amount of 0.01 to 0.5 mass%, P: 0.01~0.20% by weight , Zn: 0.01 to 1.0 mass%, Sn:. including 0.01 to 0.15 mass%, the balance being made up substantially of Cu and unavoidable impurities ;
机译:本发明的Cu-Fe基铜合金板由铅框架构成的槽的导电性和改善的导热性,改善的LED封装的散热性能,还改善了形成的Ag镀层反射膜的反射率在引线框架的表面上的LED,从而实现了LED封装的高亮度。在Cu-Fe基铜合金薄板制品中,垂直轧制的表面粗糙度Ra:0.2或更小,Rz JIS :1.2以下,RZ:1.5μm或更小,平均长度沿着平行于最大深度的方向滚动的平行方向为2〜100,垂直滚动的平均长度为1〜30,在小于等于400 nm的凹部表面上密集地形成。 Ra是算术平均粗糙度,Rz JIS 是十点平均粗糙度,Rz是最大粗糙度。 Cu-Fe基铜合金板,Joe Fe:1.8〜2.6质量%,P:0.005〜0.20重量%,Zn:0.01〜0.50(包括质量%)或Fe:0.01〜0.5质量%,P:0.01〜0.20重量%,Zn:0.01〜1.0质量%,Sn :。包括0.01至0.15质量%,其余部分主要由铜和不可避免的杂质组成;

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