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Circuit technology fdsoi with the distribution of the box, and means for biasing the ground planes of doping presents in a same casing opposite

机译:具有盒子分布的电路技术fdsoi,以及将掺杂的接地层偏置的装置存在于相对的同一壳体中

摘要

The present invention relates to an integrated circuit (2) comprising a stack of a substrate semiconductor - conductor (sub), an insulating layer (bn2) and a semi - conductive layer, including: - a first electronic component (n2) formed: - a bias circuit configured to generate a first bias voltage; - the first (vn12) and second connections, receiving the first bias voltage; - a first isolation trench (47) separating the first electronic component (n2) of the first and second connections; - a first ground plane (lpg - n) with a first type of doping; - a first box (wl - p) with a second type of doping, opposite the first type, disposed in line with the first ground plane (lpg - n), and extending in the first isolation trench (47) and into contact with the second interconnection (vn11).
机译:本发明涉及一种集成电路(2),其包括衬底半导体-导体(子),绝缘层(bn2)和半导电层的堆叠,所述堆叠包括:-形成的第一电子部件(n2):-偏置电路,被配置为产生第一偏置电压; -第一(vn12)和第二连接,接收第一偏置电压; -将第一和第二连接的第一电子元件(n2)分开的第一隔离沟槽(47); -具有第一类型掺杂的第一接地平面(lpg-n); -具有与第一类型相反的第二类型掺杂的第一盒(wl-p),其与第一接地平面(lpg-n)成一直线,并在第一隔离沟槽(47)中延伸并与第二衬底接触。第二次互连(vn11)。

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