FLATNESS MEASURING DEVICE OF BGA AND FLATNESS MEASUREMENT METHOD OF BGA

摘要

PROBLEM TO BE SOLVED: To provide a flatness measuring device of BGA for measuring deformation of a package during heating without mechanical removal of a solder ball.;SOLUTION: Measurement data 60a-1 and measurement data 60b-1 are piled together, to thereby generate ball existence surface three-dimensional shape data 16-1. Solder ball data parts 58-1 and 58-2 are determined by a ball absence surface three-dimensional shape data generation part, and the solder ball data parts 58-1 and 58-2 are removed by program processing, to thereby generate ball absence surface three-dimensional shape data 21-1.;COPYRIGHT: (C)2015,JPO&INPIT