MILLIMETER WAVEBAND SEMICONDUCTOR PACKAGE AND MILLIMETER WAVEBAND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a millimeter waveband semiconductor package having superior reproducibility.SOLUTION: A millimeter waveband semiconductor package according to the embodiment, has a metal base substance; a circuit board; and a metal lid. The base substance has a first through hole and a second through hole having planarized films provided on their inner surfaces respectively. The circuit board is arranged on the base substance, and a signal line for input and a signal line for output are provided on its surface. The lid is arranged on the circuit board, and has a first non-through hole and a second non-through hole having planarized films provided on their inner surfaces respectively. The lid is arranged on the circuit board so that the first non-through hole is arranged immediately above the first through hole of the base substance and the second non-through hole is arranged immediately above the second through hole of the base substance. The first non-through hole and the first through hole form a first waveguide, and the second non-through hole and the second through hole form a second waveguide.