首页> 外国专利> BLENDING RATIO DECISION METHOD FOR Ni-BASED MATERIAL BLENDED WITH REPAIR MATERIAL FOR DIFFUSION SOLDERING AND REPAIR MATERIAL FOR DIFFUSION SOLDERING

BLENDING RATIO DECISION METHOD FOR Ni-BASED MATERIAL BLENDED WITH REPAIR MATERIAL FOR DIFFUSION SOLDERING AND REPAIR MATERIAL FOR DIFFUSION SOLDERING

机译:扩散焊接的修补材料与镍的混合基镍基材料的混合比确定方法

摘要

PROBLEM TO BE SOLVED: To provide a method which enables a simple decision of a blending ratio of a Ni-based molten alloy powder to a Ni-based unmolten alloy powder blended with a repair material for diffusion soldering.;SOLUTION: A blending ratio decision method for a Ni-based material blended with a repair material for diffusion soldering of the embodiment includes a process for deciding a target value of a solidus line temperature requested for the repair material, a process for selecting a Ni-based molten alloy powder and a Ni-based unmolten alloy powder blended with a repair material, a process for calculating a solidus line temperature after the diffusion heat treatment of a blending agent of the Ni-based molten alloy powder and the Ni-based unmolten alloy powder at a plurality of blending ratios by means of thermodynamic calculation, a process for plotting a calculated solidus line temperature after the diffusion heat treatment with the parameter of a value calculated from a predetermined relational expression to acquire an approximation curve, and a process for deciding the blending ratios of the Ni-based molten alloy powder and the Ni-based unmolten alloy powder by using the approximation curve and a predetermined relational expression with the index of a target value of a solidus line temperature after the diffusion heat treatment.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种能够简单地确定掺有用于扩散焊接的修补材料的镍基熔融合金粉末与镍基非熔融合金粉末的混合比的方法;解决方案:确定混合比该实施方式的用于镍基材料与用于扩散焊接的修补材料混合的方法包括确定用于修补材料的固相线温度目标值的过程,选择镍基熔融合金粉末的过程以及与修补材料混合的Ni基非熔融合金粉末,在多次混合后对Ni基熔融合金粉末和Ni基非熔融合金粉末的混合剂进行扩散热处理后计算固相线温度的方法通过热力学计算的比率,该过程用于绘制扩散热处理后的计算出的固相线温度,该参数具有从预计算得到的值确定关系表达式以获得近似曲线,以及通过使用近似曲线和具有目标值的指标的预定关系表达式来确定Ni基熔融合金粉末和Ni基非熔融合金粉末的配合比的过程。扩散热处理后固相线温度的变化。;版权所有:(C)2015,日本特许厅&INPIT

著录项

  • 公开/公告号JP2015150615A

    专利类型

  • 公开/公告日2015-08-24

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP20140029282

  • 发明设计人 SAITO DAIZO;ITO KATSUYASU;SAWA TORU;

    申请日2014-02-19

  • 分类号B23K20/00;F02C7/00;F23R3/42;F01D25/00;F01D5/28;F01D9/02;B23K1/00;B23K35/30;C22C19/05;

  • 国家 JP

  • 入库时间 2022-08-21 15:35:26

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