WIRING BOARD CHEMICAL TREATMENT DEVICE AND WIRING BOARD CHEMICAL TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board chemical treatment device and a wiring board chemical treatment method capable of performing chemical treatment in an even state compared with conventional ones, to a wiring board.;SOLUTION: A wiring board chemical treatment device 10 of the invention is configured so that: an inside of a suction duct 20 is vertically partitioned by a zone wall 23; and plural communication holes 24 formed on the zone wall 23 have respectively an opening diameter, which becomes larger as separated from a piping connection part 29. In addition because of difference of negative pressure in the suction duct 20 in longitudinal direction positions, and difference of fluid resistance caused by size of the opening diameter of the communication holes 24, difference of suction force according to the position in the longitudinal direction in the suction duct 20 is relaxed. Therefore a chemical agent liquid can be sprayed newly from an injection nozzle 14 to a portion where the chemical agent liquid is removed from the wiring board 90 by the suction duct 20 in an even state compared with a conventional device, and chemical treatment using the chemical agent liquid to the wiring board 90 can be performed in an even state compared with conventional treatment.;COPYRIGHT: (C)2015,JPO&INPIT