首页> 外国专利> HEATSINK WITH PERIODICALLY PATTERNED BASEPLATE STRUCTURE, AND ASSOCIATED APPARATUS AND METHOD (HEATSINK WITH PERIODICALLY PATTERNED BASEPLATE STRUCTURE)

HEATSINK WITH PERIODICALLY PATTERNED BASEPLATE STRUCTURE, AND ASSOCIATED APPARATUS AND METHOD (HEATSINK WITH PERIODICALLY PATTERNED BASEPLATE STRUCTURE)

机译:具有周期性图案化基体结构的热沉以及相关的装置和方法(具有周期性图案化基体结构的热沉)

摘要

PROBLEM TO BE SOLVED: To provide a heatsink including an electromagnetic bandgap structure that reduces electromagnetic interference caused by an integrated circuit in an electronic device.;SOLUTION: A heatsink has a base 20 with an array of electrically conductive, thermally conductive patches 28 spaced in two dimensions of a reference plane and having a thickness perpendicular to the reference plane. The patches 28 are interconnected by a plurality of branches. Each branch connects adjacent patches 28 and has a width less than the width of each adjacent patch 28. A plurality of thermally conductive cooling fins 42 are coupled to a surface of the base 20 and extend normally to the reference plane. The cooling fins 42 may be formed of a thermally conductive, electrically non-conductive material or may be coupled to the base 20 by a thermally conductive, electrically non-conductive material. The periodically patterned structure of the base 20, together with a solid metal layer of a circuit board, forms an electromagnetic bandgap structure that reduces electromagnetic noise of frequencies caused by the integrated circuit.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种包括电磁带隙结构的散热片,该结构可以减少电子设备中集成电路引起的电磁干扰。解决方案:散热片的底座20上有一系列导电的导热贴片28基准平面的两个维度,并且具有垂直于基准平面的厚度。补片28通过多个分支互连。每个分支连接相邻的贴片28,并且宽度小于每个相邻的贴片28的宽度。多个导热冷却翅片42联接到基部20的表面并且垂直于参考平面延伸。散热片42可以由导热的,不导电的材料形成,或者可以通过导热的,不导电的材料耦合到基座20。基座20的周期性图案化结构与电路板的固体金属层一起形成电磁带隙结构,该结构减小了由集成电路引起的频率的电磁噪声。;版权所有:(C)2015,JPO&INPIT

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