SELECTIVE SEED LAYER TREATMENT FOR FEATURE PLATING

摘要

PROBLEM TO BE SOLVED: To provide a method of metallization in integrated circuits supporting smaller feature sizes.;SOLUTION: Conventional metallization processes fail at high density or small feature size patterns. For example, during patterning, dry films may collapse or lift-off, resulting in short circuits or open circuits in the metallization pattern. An exemplary method for metallization of integrated circuits includes forming features such as trenches, pads, and planes in a dielectric layer and depositing and selectively treating a seed layer in desired features of the dielectric layer. The treated regions of the seed layer may be used as a seed for electroless deposition of conductive material, such as copper, into the features. When the seed layer is of a catalytic ink, the seed layer may be treated by curing the catalytic ink with a laser.;COPYRIGHT: (C)2015,JPO&INPIT