VISCOSITY BEHAVIOR PREDICTION METHOD OF THERMOSETTING RESIN, SIMULATION SOFTWARE, MANUFACTURING METHOD OF THERMOSETTING RESIN, AND UNDERFILL MANUFACTURED BY THIS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a viscosity behavior prediction method of thermosetting resin, predicting the viscosity behavior of thermosetting resin, preventing an underfill void from being generated, and achieving good solder connection.;SOLUTION: A viscosity behavior prediction method includes: a reaction rate measurement step and a viscosity behavior measurement step of respectively measuring heat quantity peak and viscosity behavior of thermosetting resin under three types or more of rates of temperature increase; a reaction rate fitting step of fitting measurement data for each of the rates of temperature increase obtained by the reaction rate measurement step in a Kamal model to obtain a fitting curve; a viscosity behavior fitting step of fitting a parameter in the Kamal model and measurement data for each of the rates of temperature increase obtained by the viscosity behavior measurement step, in a Castro-Macosko model to obtain a fitting curve; and a virtual viscosity behavior calculation step of calculating by simulation a virtual viscosity behavior of the thermosetting resin at any rate of temperature increase based on each fitting curve for each of the rates of temperature increase obtained by the viscosity behavior fitting step.;COPYRIGHT: (C)2015,JPO&INPIT