首页> 外国专利> CUTTING METHOD OF GLASS SUBSTRATE, MANUFACTURING METHOD OF TOUCH PANEL SENSOR SUBSTRATE USING THE SAME AND TOUCH PANEL SENSOR SUBSTRATE

CUTTING METHOD OF GLASS SUBSTRATE, MANUFACTURING METHOD OF TOUCH PANEL SENSOR SUBSTRATE USING THE SAME AND TOUCH PANEL SENSOR SUBSTRATE

机译:玻璃基板的切割方法,使用相同面板的触控面板传感器基板的制造方法

摘要

PROBLEM TO BE SOLVED: To produce and supply a single kind of touch panel sensor substrate by cutting from a chemically strengthened glass substrate with a plurality of touch panel sensors formed thereon, at high quality without hindering the productivity.;SOLUTION: A cutting method of a glass substrate includes: forming a plurality of touch panel sensors on one surface of a glass substrate 50 chemically strengthened by ion exchange and a cutting target area 40 including an oxide semiconductor on a periphery of the plurality of touch panel sensors 10; and thereafter, cutting at the cutting target area 40.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:通过从化学强化的玻璃基板上切割形成有多个触摸面板传感器的高质量基板,来切割和生产单一种类的触摸面板传感器基板,而不会影响生产率。 1。一种玻璃基板,其特征在于,在通过离子交换而化学强化的玻璃基板50的一个面上形成有多个触摸面板传感器,在多个触摸面板传感器10的周围形成有包含氧化物半导体的切割对象区域40。之后在切割目标区域40切割。版权所有:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2015079436A

    专利类型

  • 公开/公告日2015-04-23

    原文格式PDF

  • 申请/专利权人 TOPPAN PRINTING CO LTD;

    申请/专利号JP20130217456

  • 发明设计人 TANAKA HITOMI;HINOKIBAYASHI YASUHIRO;

    申请日2013-10-18

  • 分类号G06F3/041;C03B33/023;C03C21/00;C03C17/34;

  • 国家 JP

  • 入库时间 2022-08-21 15:33:27

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