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OPTICAL RESIN MATERIAL, OPTICAL PARTS, AND METHOD OF ASSESSING AMORPHOUS PROPERTY OF OPTICAL RESIN MATERIAL

机译:光学树脂材料,光学零件和评估光学树脂材料非晶态性能的方法

摘要

PROBLEM TO BE SOLVED: To provide an optical resin material having superior optical durability.;SOLUTION: An optical resin material of the present invention is obtained by chemically modifying hydroxyl groups of a polysaccharide extracted from an organism. The storage elastic modulus of the optical resin material of the present invention is measured using a viscoelastometer by setting a measurement lower limit temperature at the lower of 130°C or Tg of the resin material and a measurement upper limit temperature at a temperature at which the resin material exhibits fluidity and repeating one to five sets of measurement, inclusive, where one set of measurement is defined as measuring the storage elastic modulus of the resin material while changing the temperature of the resin material from a measurement start temperature, defined to be the measurement upper limit temperature, to the measurement lower temperature and then turning the temperature of the resin material back to the measurement start temperature. Each of the storage elastic modulus values repetitively measured at each temperature during the repetitive measurement by the viscoelastometer shall be less than twice the other values of storage elastic modus acquired at the same temperature during the repetitive measurement.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供具有优异的光学耐久性的光学树脂材料。解决方案:本发明的光学树脂材料是通过对从生物体提取的多糖的羟基进行化学修饰而获得的。本发明的光学树脂材料的储能弹性模量是使用粘弹性计通过将测定下限温度设定为树脂材料的Tg或Tg的下限130℃,将测定上限温度设定为在该温度下的温度来测定的。树脂材料表现出流动性并重复1至5组测量(包括1组和5组),其中一组测量定义为在从测量起始温度改变树脂材料温度的同时测量树脂材料的储能弹性模量,定义为测量上限温度,降低到测量下限温度,然后将树脂材料的温度转回到测量起始温度。粘弹性仪在重复测量过程中在每个温度下重复测量的每个储能弹性模量值应小于在重复测量过程中在相同温度下获得的储能弹性模量的其他值的两倍。;版权:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2015011236A

    专利类型

  • 公开/公告日2015-01-19

    原文格式PDF

  • 申请/专利权人 KENSYU CO LTD;

    申请/专利号JP20130137446

  • 发明设计人 KURACHI IKUO;

    申请日2013-06-28

  • 分类号G02B1/04;C08B37/00;C08B3/08;G11B7/135;

  • 国家 JP

  • 入库时间 2022-08-21 15:33:15

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