Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4-Bis(p-aminophenoxy) biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.
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