首页> 外国专利> LASER SCRIBE DEVICE AND LASER SCRIBE PROCESSING METHOD

LASER SCRIBE DEVICE AND LASER SCRIBE PROCESSING METHOD

机译:激光划痕装置和激光划痕处理方法

摘要

PROBLEM TO BE SOLVED: To provide a laser scribe device and a laser scribe processing method in which scribe processing can be applied to each thin film of plural layers without affecting on a lower part layer and cost reduction can be achieved.;SOLUTION: The laser scribe device includes a laser light source which oscillates a laser beam, an optical unit which condenses the laser beam oscillated by the laser light source and irradiates each thin film with the light, and optical unit control means 16a which controls to change the imaging position by condensing of the optical unit corresponding to the height position of each layer. The optical unit control means 16a includes imaging.beam waist position switching control part 16aa which switches the position of the laser beam corresponding to the height of a film to the imaging position or a beam waist position, corresponding to the thin film to which scribe processing is to be applied.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:提供一种激光划片装置和激光划片加工方法,其中可以在不影响下部层的情况下对多层的每个薄膜进行划片加工,并且可以实现成本降低。划线装置包括:使激光束振荡的激光源;使由激光源振荡的激光束会聚并向各薄膜照射光的光学单元;以及控制光学单元控制单元16a以改变成像位置的光学单元控制装置16a。对应于每一层的高度位置的光学单元的聚光。光学单元控制装置16a包括成像束腰位置切换控制部分16aa,其将与膜的高度相对应的激光束的位置切换为与被划线处理的薄膜相对应的成像位置或束腰位置。 ;版权所有:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2015020173A

    专利类型

  • 公开/公告日2015-02-02

    原文格式PDF

  • 申请/专利权人 NTN CORP;

    申请/专利号JP20130147424

  • 发明设计人 IGI TAISUKE;

    申请日2013-07-16

  • 分类号B23K26/364;B23K26/073;B23K26/066;B23K26/00;B23K26/046;H01L31/06;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:30

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