THERMAL PEELING TYPE ADHESIVE TAPE FOR CUTTING-OFF ELECTRONIC COMPONENT AND CUTTING-OFF METHOD OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a thermal peeling type adhesive tape for cutting off an electronic component, having sufficient retention necessary at cutting processing, with no electrode contamination in the electronic component after thermal peeling, and also to provide a cutting-off processing method of an electronic component using the thermal peeling type adhesive tape.SOLUTION: A thermal peeling type adhesive tape has a thermal expansion adhesive layer formed thereon. In the thermal expansion adhesive layer, a probe tack value is 60 N/5 mm or more (when measured at immersion speed: 30 mm/min, test speed: 30 mm/min, preload: 100 gf, and press time:1.0 sec.).