Heat conduction in composites of thermally dissimilar materials - a methodology to economize numerical heat transfer analysis of electronic components

摘要

The purpose of this study is to develop a set of guides regarding modeling of heat conduction process in electronic components. In the analysis of transient heat conduction in printed circuit boards, the assumption of quasi-steady state is permissible in a certain range of heat generation frequency and a spatial range removed from the heat source. To demarcate a parametric zone for quasi-steady state analysis a model is devised so as to allow classical analytical solution by exploiting radically different thermal properties of resin and copper. A similar approximate analysis is applied to a steady heat conduction problem where high-conductivity and low-conductivity tiles are laid out in mosaic patterns. The solution on this model provides a guide regarding the sensitivity of the heat source temperature on the spatial resolution of composite structure in numerical analysis.