COPPER PLATING SOLUTION COMPOSITION FOR PRINTED WIRING BOARD, AND VIA HOLE FILLING METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide: a copper plating solution composition for a printed wiring board effective for preventing voids, dimples and overfill phenomena in a via hole in a process of filling the via hole by electrolytic copper plating, by adding an organic additive and a reducing agent that is used in a mechanism of chemical copper plating; and a via hole filling method using the same.SOLUTION: A copper plating solution composition for a printed wiring board contains a copper salt, an acid, a brightening aid, a brightening agent, polyvinylpyrrolidone, and a reducing agent.