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Electronic component package base, electronic component package

机译:电子元器件包装体,电子元器件包装体

摘要

A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face.
机译:电子部件包装的基座容纳电子部件元件。底座在平面图中具有矩形的底面。基座包括在底面上具有矩形形状的一对端子电极。一对端子电极用导电性的接合材料接合在外部电路基板上。一对端子电极具有相互对称的形状。每个端子电极具有与底面的长边相邻或在其底边的长边上的长边。每个端子电极的长边平行于底面的长边设置。每个端子电极的长边的长度大于底面的长边的长度的一半。

著录项

  • 公开/公告号JP5757287B2

    专利类型

  • 公开/公告日2015-07-29

    原文格式PDF

  • 申请/专利权人 株式会社大真空;

    申请/专利号JP20120506938

  • 发明设计人 前田 佳樹;草井 強;

    申请日2011-03-11

  • 分类号H01L23/04;H03H9/02;

  • 国家 JP

  • 入库时间 2022-08-21 15:30:03

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