New organic silicon compound, a thermosetting resin composition containing an organic silicon compound, curing the resin and for an optical semiconductor sealing material

摘要

To provide a silicone resin-based thermosetting resin composition that can obtain a hardened material having a high refractive index and a good heat resistance. A solution is a liquid organosilicon compound represented by general formula (1) as described below: (1) wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) (or the number of groups per one mean molecule of the compound when the compound is a mixture having a different ratio for the group represented by formula (I), the group represented by formula (II) and the group represented by formula (III) ) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0 ‰¤ a ‰¤ 3.5, 0 ‰¤ b ‰¤ 3.5, and 0 ‰¤ c ‰¤ 1 are obtained, and also a + b + 2c = 4 is obtained: wherein, R 1 is each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl and cyclohexyl, R 2 and R 3 are each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl, cyclohexyl and phenyl, m and n are the number of repetitions of -OSi(R 3 ) 2 -, and a mean value satisfying 1 to 50.