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Optical semiconductor encapsulation materials for thermosetting resin composition containing novel organic silicon compounds, the organic silicon compound, and curing the resin

机译:用于包含新型有机硅化合物,有机硅化合物的热固性树脂组合物的光学半导体封装材料,以及用于固化树脂的光学半导体封装材料

摘要

Liquid organic silicon compound represented by the following general formula (1). Here, X is independently selected the following formula (I), (II), from (III). Also, assuming that c the number b, of formula (III) the number a, of formula (II) above compound per molecule (on average), the number of formula (I), satisfies the following relationship. 0 ≦ a ≦ 3.5, 0 ≦ b ≦ 3.5, 0 ≦ c ≦ 1, a + b + 2c = 4Wherein the 2, R 3 R 1, R, a set of alternatives (C1~C4), cyclopentyl, cyclohexyl alkyl, 2, R 3 R, phenyl and alternatives further. m, n is an average value of 1 to 50 meet.
机译:以下通式(1)表示的液态有机硅化合物。在此,X从(III)独立地选自下式(I),(II)。同样,假设c(式(III)中的b数,式(II)中的a,化合物平均每分子以上),式(I)中的数满足以下关系。 0≤a≤3.5,0≤b≤3.5,0≤c≤1,a + b + 2c = 4 其中 2,R 3 R 1,R,一组取代基(C1〜C4),环戊基,环己基烷基, 2, R 3 R,苯基以及更多替代物。 m,n是1到50满足的平均值。

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