Spindle descent information detecting mechanism and substrate processing device incorporating spindle descent information detecting mechanism

摘要

PROBLEM TO BE SOLVED: To enable the presence or absence of a contact of a drill on a desired conductor layer to exactly be detected by eliminating a disturbance factor or the like when a bore hole is made down to a desired conductor layer of a substrate by drilling with a spindle.;SOLUTION: A pair of two of the same substrates is fixed inside a processing apparatus: when one substrate is bored with a spindle to make a drill come in contact with a desired conductor layer by connecting one of high-frequency AC outputs so that flux directions generated by a current transformer in two input coils of the current transformer may cancel each other to electrify a desired conductor layer of both the substrates, the contact causes electric current to flow via an electrostatic capacitance between the spindle body of the spindle and the rotor, electric current accordingly develops in the output coil side of the current transformer, so that the presence or absence of a contact of a drill on a desired conductor layer is determined with the result that drop distance information from an initial position of the spindle to this conductor layer can be acquired.;COPYRIGHT: (C)2015,JPO&INPIT