首页> 外国专利> The evaluation apparatus of a compound semiconductor thin film, the evaluation method of a compound semiconductor thin film, and the manufacturing method of a solar cell.

The evaluation apparatus of a compound semiconductor thin film, the evaluation method of a compound semiconductor thin film, and the manufacturing method of a solar cell.

机译:化合物半导体薄膜的评价装置,化合物半导体薄膜的评价方法以及太阳能电池的制造方法。

摘要

PROBLEM TO BE SOLVED: To provide a compound semiconductor thin film evaluation device which can detect a partial defect in a compound semiconductor thin film and inspect the whole of the compound semiconductor thin film.SOLUTION: A compound semiconductor thin film evaluation device 2 of the present invention comprises a light transmissive exterior package 4 on which an opening is formed, a light transmissive polymer gel electrolyte layer 6 disposed on inside the opening to close the opening, an electrolytic solution 12 infiltrating the polymer gel electrolyte layer 6, a light source 18 disposed on inside the exterior package 4 for irradiating a surface of the polymer gel electrolyte layer 6 facing inward of the exterior package 4 with light, a counter electrode 8 contacting with a part of the surface of the polymer gel electrolyte layer 6 facing inward of the exterior package 4, a reference electrode 10 contacting with a part of the surface of the polymer gel electrolyte layer 6 facing inward of the exterior package 4, and a potentiostat 60 to which the counter electrode 8 and the reference electrode 10 are electrically connected.
机译:解决的问题:提供一种化合物半导体薄膜评估装置,其可以检测化合物半导体薄膜中的部分缺陷并检查整个化合物半导体薄膜。解决方案:本发明的化合物半导体薄膜评估装置2本发明包括在其上形成开口的透光外包装4,设置在开口内部以封闭开口的透光聚合物凝胶电解质层6,渗透到聚合物凝胶电解质层6中的电解液12,设置的光源18。在外包装4的内部,用光照射朝外包装4的内部的聚合物凝胶电解质层6的表面,对电极8与朝外的内侧的聚合物凝胶电解质层6的表面的一部分接触。封装4,参考电极10与聚合物凝胶电解质层6的面向表面的一部分接触在外部封装4的内部,以及与反电极8和参比电极10电连接的稳压器60。

著录项

  • 公开/公告号JP5729093B2

    专利类型

  • 公开/公告日2015-06-03

    原文格式PDF

  • 申请/专利权人 TDK株式会社;

    申请/专利号JP20110080657

  • 发明设计人 栗原 雅人;フィリップ デール;

    申请日2011-03-31

  • 分类号H02S50/10;H01L31/0749;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 15:29:13

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