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Estimation method of junction temperature of the semiconductor device, estimating system and estimation program

机译:半导体器件的结温估计方法,估计系统和估计程序

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element junction temperature estimation method, estimation system and estimation program which help to find the junction temperature of a semiconductor element with high accuracy.;SOLUTION: A junction temperature estimation system 2 comprises: an arithmetic processing device 10; an input device 20; a storage device 30; and an output device 40. The storage device 30 stores energization condition and other information 32, voltage temperature characteristic information 34, and an arithmetic operation program 36. The arithmetic operation program 36 is a program stipulating an arithmetic process in which the junction temperature of a semiconductor element under a prescribed energization condition corresponding to an elapse of time after energization has started under the energization condition is calculated a prescribed number of times. When the arithmetic operation program 36 is executed, calculations are performed in steps, including the acquisition or calculation of Tjn, the acquisition of a forward voltage VFn at Tjn, the acquisition of a I1 value, the calculation of Pn, and the calculation of ΔTjn.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种有助于高精度地找到半导体元件的结温度的半导体元件结温度估计方法,估计系统和估计程序。解决方案:结温度估计系统2包括:算术处理装置10;输入装置20;存储设备30;存储装置30存储通电条件等信息32,电压温度特性信息34和算术运算程序36。算术运算程序36是规定了将半导体芯片的结点温度设为零的运算处理的程序。计算与在通电条件下开始通电之后经过的时间相对应的规定通电条件下的半导体元件的规定次数。当执行算术运算程序36时,分步骤进行计算,包括T jn 的获取或计算,T Fn 的获取。 > jn ,获取I 1 值,计算P n 和计算ΔT jn 。版权:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP5742642B2

    专利类型

  • 公开/公告日2015-07-01

    原文格式PDF

  • 申请/专利权人 三菱電機株式会社;

    申请/专利号JP20110221958

  • 发明设计人 吉村 晃一;井浦 真一;

    申请日2011-10-06

  • 分类号G01K7/00;H01L23/467;H01L23/58;

  • 国家 JP

  • 入库时间 2022-08-21 15:29:14

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