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Package Substrate and Package Structure of Light Emitting Diode and Fabrication Thereof
Package Substrate and Package Structure of Light Emitting Diode and Fabrication Thereof
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机译:发光二极管的封装基板及其封装结构及其制作方法
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摘要
A package substrate of a flip-chip light emitting diode applicable to eutectic bonding process, including a substrate body with a first surface, having thereon distributed with at least one unit, wherein the unit corresponds to a light emitting diode core grain and has a first region and a second region that are electrically isolated; and a groove structure between the two regions, wherein a top opening width of the groove structure is less than a width of the core grain to be packaged. The structure and method can reduce failures in the further substrate removal and surface roughening processes in existing flip-chip light-emitting diode of eutectic bonding process as a result of the distance between the chip and the substrate being too small to fill the under-fill at bottom.
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