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METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WITH RADIATION CURABLE OR THERMAL CURABLE SOLDER FLUX
METHODS AND COMPOSITIONS FOR FORMING SOLDER BUMPS ON A SUBSTRATE WITH RADIATION CURABLE OR THERMAL CURABLE SOLDER FLUX
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机译:在具有辐射可固化或热可固化焊剂通量的基体上形成焊球凸点的方法和组成
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摘要
Methods of forming solder bumps or joints using a radiation curable, thermal curable solder flux, or dual curable solder flux are disclosed. The method includes applying a liquid solder flux that is radiation curable or thermal curable to a substrate such that the solder flux covers contact pads on the substrate; placing solder balls on the contacts pads covered with the radiation curable or thermal curable solder flux; heating the substrate to join the solder balls to the contact pads, thereby forming solder bumps or solder joints; and curing the liquid solder flux by applying radiation or heat to the substrate, thereby forming a solid film. The solder flux includes radiation curable, thermally curable, or dual curable materials that aid formation of solder bumps or joints before the solder flux is cured; and are curable to form a solid material by the application of radiation or heat.
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