首页> 外国专利> METHOD FOR FABRICATING TRANSFER PRINTING SUBSTRATE USING CONCAVE-CONVEX STRUCTURE, TRANSFER PRINTING SUBSTRATE FABRICATED THEREBY AND APPLICATION THEREOF

METHOD FOR FABRICATING TRANSFER PRINTING SUBSTRATE USING CONCAVE-CONVEX STRUCTURE, TRANSFER PRINTING SUBSTRATE FABRICATED THEREBY AND APPLICATION THEREOF

机译:利用凹凸结构制造转移印刷基体的方法,由此制造的转移印刷基体及其应用

摘要

The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling to substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. The present invention allows a process of manufacturing a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process.
机译:本公开提供一种使用凹凸结构来制造用于转印的基板的方法以及由此制造的用于转印的基板。该方法包括准备在其上形成有凹凸结构的处理基板;以及在处理基板上沿着凹凸结构形成牺牲层;将聚合物涂覆在其上形成有牺牲层的处理基板上,以形成具有凸块填充凹凸结构的凹部的聚合物基板;以及从处理到衬底去除牺牲层。转印用基板包括:处理基板,其上形成有凹凸结构;和聚合物基板,其放置在凹凸结构上并具有填充处理基板的凹凸结构的凹部的凸块。本发明允许在超薄基板上稳定地执行器件的制造过程,并且可以在转印印刷过程中确保高度的对准度和高的转印成品率。

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