首页> 外国专利> IMPLANTABLE ELECTRODE ARRAY ASSEMBLY INCLUDING A CARRIER WITH EMBEDDED CONTROL MODULES CONTAINED IN PACKAGES, THE PACKAGES EXTENDING OUTWARDLY SO AS TO EXTEND OVER THE CARRIER

IMPLANTABLE ELECTRODE ARRAY ASSEMBLY INCLUDING A CARRIER WITH EMBEDDED CONTROL MODULES CONTAINED IN PACKAGES, THE PACKAGES EXTENDING OUTWARDLY SO AS TO EXTEND OVER THE CARRIER

机译:可移植的电极阵列,包括带有包装中包含的嵌入式控制模块的载体,该包装向外扩展,以便扩展到载体上

摘要

An implantable electrode array that includes a carrier on which multiple spaced apart electrodes are disposed. Embedded in the module are control modules. The control modules are contained in packages. Portions of the packages extend outwardly from the carrier so as to be disposed against adjacent surfaces of the carrier. The packages contain conductive tracts that provide conductive links from the conductors internal to the carrier to the packaged control modules.
机译:一种可植入电极阵列,其包括在其上布置有多个间隔开的电极的载体。嵌入在模块中的是控制模块。控制模块包含在软件包中。包装的部分从载体向外延伸,从而抵靠载体的相邻表面设置。封装中包含导电线,这些导电线提供从载体内部的导体到封装的控制模块的导电链接。

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