首页> 外国专利> METHOD OF MANUFACTURING MICROLENS ARRAY SUBSTRATE, MICROLENS ARRAY SUBSTRATE, ELECTRO-OPTIC DEVICE, AND ELECTRONIC

METHOD OF MANUFACTURING MICROLENS ARRAY SUBSTRATE, MICROLENS ARRAY SUBSTRATE, ELECTRO-OPTIC DEVICE, AND ELECTRONIC

机译:制造微阵列阵列基体,微阵列阵列基体,光电器件和电子的方法

摘要

There is provided a method of manufacturing a microlens array substrate with improved manufacturing yield and high quality, the method including: forming a groove part along an outer edge of a first area on a surface of a substrate; forming a mask layer to cover a side of the surface, forming a plurality of openings in the first area, and forming openings along the outer edge of the first area; performing isotropic etching on the substrate through the mask layer, forming a plurality of recesses in the first area, and forming recesses across a boundary part between the first area and the groove part; removing the mask layer from the substrate; forming a light transmission material layer that has a refractive index, which is different from a refractive index of the substrate, to cover the side of the surface of the substrate and to bury the plurality of recesses; and planarizing an upper surface of the light transmission material layer.
机译:提供了一种具有提高的制造成品率和高质量的微透镜阵列基板的制造方法,该方法包括:在基板表面上沿着第一区域的外边缘形成凹槽部分;以及在基板表面上形成凹槽部分。形成掩模层以覆盖表面的一侧,在第一区域中形成多个开口,并且沿着第一区域的外边缘形成开口;通过掩模层在基板上进行各向同性蚀刻,在第一区域中形成多个凹槽,并在第一区域与凹槽部之间的边界部分上形成凹槽。从基板上去除掩模层;形成具有与基板的折射率不同的折射率的透光材料层,以覆盖基板的表面的一侧并掩埋多个凹部;平坦化透光材料层的上表面。

著录项

  • 公开/公告号US2015092139A1

    专利类型

  • 公开/公告日2015-04-02

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号US201414480984

  • 发明设计人 YOSHIKAZU EGUCHI;

    申请日2014-09-09

  • 分类号G02B3/00;G03B21/00;G02F1/1335;

  • 国家 US

  • 入库时间 2022-08-21 15:22:40

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