首页> 外国专利> METHOD FOR MANUFACTURING MICROLENS ARRAY SUBSTRATE, MICROLENS ARRAY SUBSTRATE, ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS

METHOD FOR MANUFACTURING MICROLENS ARRAY SUBSTRATE, MICROLENS ARRAY SUBSTRATE, ELECTRO-OPTIC DEVICE AND ELECTRONIC APPARATUS

机译:制造微阵列阵列基体,微阵列阵列基体,光电器件和电子设备的方法

摘要

To provide a method for manufacturing a microlens array substrate, by which the process of manufacturing is simplified and a flat portion is formed with high accuracy, a microlens array substrate, an electro-optic device, and an electronic apparatus.SOLUTION: A method for manufacturing a microlens array substrate ML includes: a step S1 of forming a high refractive index film 25m on a transparent substrate 21; a step S2 of forming a first low refractive index film 26m having a refractive index lower than that of the high refractive index film 25m on the high refractive index film 25m; a step S3 of forming a resist pattern 61 in a formation region of a microlens ML on the first low refractive index film 26m; a step S4 of heat treating the resist pattern 61 to deform the heat resist pattern 61 into a convex shape including a slope on an outer circumference side; and a step S5 of etching the high refractive index film 25m and the first low refractive index film 26m through the deformed resist pattern 61 so as to transfer the convex shape of the resist pattern 61.SELECTED DRAWING: Figure 2
机译:提供一种微透镜阵列基板,电光装置和电子设备的微透镜阵列基板的制造方法,该方法简化了制造过程并且高精度地形成了平坦部。制造微透镜阵列基板ML包括:步骤S1,在透明基板21上形成高折射率膜25m;步骤S2,在高折射率膜25m上形成折射率比高折射率膜25m低的第一低折射率膜26m。步骤S3,在第一低折射率膜26m上的微透镜ML的形成区域中形成抗蚀剂图案61。在步骤S4中,对抗蚀剂图案61进行热处理,使抗蚀剂图案61变形为在外周侧具有倾斜的凸状。步骤S5是通过变形的抗蚀剂图案61蚀刻高折射率膜25m和第一低折射率膜26m,以转印抗蚀剂图案61的凸形。选择图:图2

著录项

  • 公开/公告号JP2020008678A

    专利类型

  • 公开/公告日2020-01-16

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORP;

    申请/专利号JP20180128840

  • 发明设计人 EGUCHI YOSHIKAZU;

    申请日2018-07-06

  • 分类号G02B3;G02F1/1335;

  • 国家 JP

  • 入库时间 2022-08-21 11:36:51

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