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Thermoelectric Structures and Devices Based on Topological Insulators

机译:基于拓扑绝缘子的热电结构和装置

摘要

Method and apparatus are provided for improving the thermoelectric figure of merit (zT) for thermoelectric structures and devices based on topological insulators. In one novel aspect, the zT of the TI is increased by optimizing geometric sizes of the TI. In one embodiment, the zT is increased by increasing the length of the TI to be greater than the inelastic mean free path length. In another embodiment, the zT is increased by decrease the width of a 2D TI to be about three times the localized localization width ξ of the boundary state of the TI, or to decrease the thickness of a 3D TI to be about three times of ξ. In one novel aspect of the current invention, methods are provided to increase zT of the TI by substantially maximizing a relative thermoelectric-transport contribution of the boundary state with respect to the bulk states.
机译:提供了用于改善基于拓扑绝缘体的热电结构和装置的热电品质因数(zT)的方法和装置。在一个新颖的方面,通过优化TI的几何尺寸来增加TI的zT。在一个实施例中,通过将TI的长度增加到大于非弹性平均自由程长度来增加zT。在另一实施例中,通过将2D TI的宽度减小为TI的边界状态的局部化局部宽度ξ的三倍来增加zT,或者将3D TI的厚度减小为ξ的约三倍来增加zT。 。在本发明的一个新颖方面,提供了通过基本上最大化边界态相对于体态的相对热电传输贡献来增加TI的zT的方法。

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