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SEMICONDUCTOR DEVICES HAVING BIT LINE STRUCTURES DISPOSED IN TRENCHES, METHODS OF FABRICATING THE SAME, PACKAGES INCLUDING SAME, MODULES INCLUDING THE SAME, AND SYSTEMS INCLUDING THE SAME
SEMICONDUCTOR DEVICES HAVING BIT LINE STRUCTURES DISPOSED IN TRENCHES, METHODS OF FABRICATING THE SAME, PACKAGES INCLUDING SAME, MODULES INCLUDING THE SAME, AND SYSTEMS INCLUDING THE SAME
Semiconductor devices are provided. The semiconductor device includes a bit line contact plug and a storage node contact plug electrically connected to an active region of a substrate. A bit line structure is disposed on the bit line contact plug to extend in a first direction. The bit line structure is disposed in a trench pattern that intrudes into a side of the storage node contact plug. Related methods and systems are also provided.
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