首页> 外国专利> SEMICONDUCTOR DEVICES HAVING BIT LINE STRUCTURES DISPOSED IN TRENCHES, METHODS OF FABRICATING THE SAME, PACKAGES INCLUDING SAME, MODULES INCLUDING THE SAME, AND SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICES HAVING BIT LINE STRUCTURES DISPOSED IN TRENCHES, METHODS OF FABRICATING THE SAME, PACKAGES INCLUDING SAME, MODULES INCLUDING THE SAME, AND SYSTEMS INCLUDING THE SAME

机译:具有在沟槽中布置的位线结构的半导体设备,制造方法相同的方法,包括方法相同的包装,包括方法相同的模块以及包括方法相同的系统

摘要

Semiconductor devices are provided. The semiconductor device includes a bit line contact plug and a storage node contact plug electrically connected to an active region of a substrate. A bit line structure is disposed on the bit line contact plug to extend in a first direction. The bit line structure is disposed in a trench pattern that intrudes into a side of the storage node contact plug. Related methods and systems are also provided.
机译:提供了半导体器件。该半导体器件包括电连接到衬底的有源区的位线接触塞和存储节点接触塞。位线结构设置在位线接触塞上以在第一方向上延伸。位线结构以进入到存储节点接触塞的侧面的沟槽图案设置。还提供了相关的方法和系统。

著录项

  • 公开/公告号US2015028492A1

    专利类型

  • 公开/公告日2015-01-29

    原文格式PDF

  • 申请/专利权人 SK HYNIX INC.;

    申请/专利号US201414178127

  • 发明设计人 JIN KI JUNG;MYOUNG SOO KIM;

    申请日2014-02-11

  • 分类号H01L23/48;

  • 国家 US

  • 入库时间 2022-08-21 15:22:15

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