SURFACE-MODIFIED INORGANIC FILLER, METHOD FOR PREPARING THE SAME, EPOXY RESIN COMPOSITION AND INSULATING FILM INCLUDING THE SAME

摘要

Disclosed herein is a surface-modified inorganic filler including an alkyl group and an amine group sequentially introduced on a surface thereof, wherein the alkyl group and the amine group are introduced on the surface of the inorganic filler in a weight ratio between the alkyl group and the amine group of 0.5:9.5 to 4:6. An epoxy resin composition including the surface-treated inorganic filler according to the present invention may have low dielectric loss rate and low coefficient of thermal expansion properties.