首页> 外国专利> SURFACE MODIFIED INORGANIC FILLER, METHOD FOR MANUFACTURING THE SAME, EPOXY RESIN COMPOSITION AND INSULATING FILM INCLUDING THE SAME

SURFACE MODIFIED INORGANIC FILLER, METHOD FOR MANUFACTURING THE SAME, EPOXY RESIN COMPOSITION AND INSULATING FILM INCLUDING THE SAME

机译:表面改性的无机填料,其制造方法,环氧树脂组合物和包括该膜的绝缘膜

摘要

In the present invention, provide that a kind of whose surface of surface-modified inorganic filler is introduced continuously into alkyl and amino, wherein the alkyl amine group is introduced than being 0.5 to 9.5 or 4 to 6. In the present invention, composition epoxy resin includes the characteristic that the modified inorganic filler in surface has a low dielectric loss data rate and the low coefficient of expansion. ;The 2015 of copyright KIPO submissions
机译:在本发明中,提供一种将其表面改性的无机填料的表面连续引入到烷基和氨基中的方法,其中烷基胺基的引入比为0.5至9.5或4至6。树脂具有表面改性的无机填料具有低介电损耗数据率和低膨胀系数的特性。 ; 2015年版权KIPO提交文件

著录项

  • 公开/公告号KR20150037114A

    专利类型

  • 公开/公告日2015-04-08

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRO-MECHANICS CO. LTD.;

    申请/专利号KR20130116384

  • 发明设计人 이화영;심지혜;김기석;

    申请日2013-09-30

  • 分类号H01B3/12;H01B17/62;H01B3/40;H05K3/28;

  • 国家 KR

  • 入库时间 2022-08-21 15:00:23

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