首页> 外国专利> SURFACE-MODIFIED INORGANIC FILLER, METHOD FOR MANUFACTURING SAME, BUILD-UP FILM COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD INCLUDING SAME

SURFACE-MODIFIED INORGANIC FILLER, METHOD FOR MANUFACTURING SAME, BUILD-UP FILM COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD INCLUDING SAME

机译:表面改性的无机填料,制造方法相同的产品,多层印刷线路板的增强膜组合物和多层印刷线路板(包括同一印刷线路板)

摘要

Provided in the present invention are a method for manufacturing a surface-modified inorganic filler which comprises the steps of: drying an inorganic filler; bonding fluorine (F) on a part of the surface of the inorganic filler by treating the inorganic filler with a fluorine gas; and combining a silane coupling agent having a functional group on the surface on which the fluorine of the inorganic filler bonded with the fluorine is not bonded, and a surface-modified inorganic filler formed by the manufacturing method.;COPYRIGHT KIPO 2014
机译:本发明提供了一种表面改性的无机填料的制造方法,该方法包括以下步骤:干燥无机填料;和通过用氟气处理无机填料,将氟(F)结合在无机填料的一部分表面上。并结合具有在其上未键合的无机填料的氟未结合的表面上具有官能团的硅烷偶联剂,以及通过该制造方法形成的表面改性的无机填料。; COPYRIGHT KIPO 2014

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