Multifunctional substrate polishing and burnishing device and polishing and burnishing method thereof

摘要

A substrate grinding and polishing device comprising separate grinding and polishing units for operating on a work-piece. The work piece is clamped to a rotating work table under the units and a track underneath the rotating work table allows for quick transfer from the grinding unit to the polishing unit or vice versa. This setup allows for easy transfer as well as quick adjustment between different modes of grinding and polishing.