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Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same
Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same
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机译:焊盘上焊料结构的制造方法以及使用该方法的倒装芯片接合方法
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摘要
A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.
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