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Method for producing p-type ZnO based compound semiconductor layer, method for producing ZnO based compound semiconductor element, and an n-type ZnO based compound semiconductor laminate structure
Method for producing p-type ZnO based compound semiconductor layer, method for producing ZnO based compound semiconductor element, and an n-type ZnO based compound semiconductor laminate structure
A method for producing a p-type ZnO based compound semiconductor layer including the steps of (a) supplying (i) Zn, (ii) O, (iii) optional Mg, and (iv) a Group 11 element which is Cu and/or Ag to form a MgxZn1-xO (0≦x≦0.6) single crystal film doped with the Group 11 element; (b) supplying at least one Group 13 element selected from the group consisting of B, Ga, Al, and In on the MgxZn1-xO (0≦x≦0.6) single crystal film; (c) alternately carrying out the steps (a) and (b) to form a laminate structure; and (d) annealing the laminate structure to form a p-type MgxZn1-xO (0≦x≦0.6) layer co-doped with the Group 11 element and the Group 13 element.
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机译:一种用于制造p型ZnO基化合物半导体层的方法,该方法包括以下步骤:(a)提供(i)Zn,(ii)O,(iii)可选Mg和(iv)Cu和// 11族元素或Ag形成掺杂有第11族元素的Mg x Sub> Zn 1-x Sub> O(0≤x≤0.6)单晶膜;或(b)在Mg x Sub> Zn 1-x Sub> O上提供至少一种选自B,Ga,Al和In的13族元素(0≤ x≤0.6)单晶膜; (c)交替进行步骤(a)和(b)以形成层压结构; (d)对叠层结构进行退火,以形成共掺杂有第11组的p型Mg x Sub> Zn 1-x Sub> O(0≤x≤0.6)层元素和第13组元素。
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