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Adhesive wafer bonding with sacrificial spacers for controlled thickness variation
Adhesive wafer bonding with sacrificial spacers for controlled thickness variation
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机译:具有牺牲性垫片的粘性晶圆键合,可控制厚度变化
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摘要
A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers.
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